Thin Film Process Engineer – Semiconductor Wafer Fabrication

Thin Film Process Engineer Semiconductor Wafer Fabrication

Location: Ahmedabad, Gujarat, India

Work Mode: Onsite

Experience: 6 15 Years

Role Overview

We are seeking an experienced Thin Film Process Engineer to develop, optimize, qualify, and sustain thin film deposition processes within an advanced semiconductor wafer fabrication facility. This role is responsible for establishing stable deposition processes for dielectric, conductive, barrier, and semiconductor films that meet stringent electrical, physical, and reliability requirements while enabling high-volume semiconductor manufacturing.

The successful candidate will collaborate with Process Integration, Lithography, Etch, CMP, Diffusion, Ion Implant, Yield Engineering, Equipment Engineering, Manufacturing, Metrology, and Quality teams to optimize thin film processes, improve yield, qualify new materials, and support technology ramp-up.

Candidates should possess strong expertise in CVD, PECVD, LPCVD, ALD, PVD, sputtering, epitaxy, film characterization, stress control, and Statistical Process Control (SPC).

Role Objectives

• Develop world-class thin film deposition processes.
• Achieve excellent film uniformity, composition, thickness, and electrical performance.
• Improve manufacturing yield through process optimization.
• Support technology transfer and high-volume manufacturing.
• Deliver repeatable, scalable, and robust deposition processes.

Key Responsibilities

• Develop, optimize, and sustain thin film deposition processes for advanced semiconductor manufacturing.
• Establish process windows for dielectric, metal, barrier, and semiconductor film deposition.
• Optimize deposition recipes for film thickness, uniformity, stress, step coverage, conformality, resistivity, and adhesion.
• Develop and qualify CVD, PECVD, LPCVD, ALD, PVD, sputtering, and epitaxial growth processes.
• Evaluate new precursor chemistries, process gases, deposition materials, and consumables.
• Perform Design of Experiments (DOE) to optimize film characteristics and process capability.
• Analyze metrology, electrical test, and yield data to identify process improvement opportunities.
• Drive continuous reduction of particles, film defects, voids, delamination, contamination, and non-uniformity.
• Collaborate with Etch, CMP, Lithography, Diffusion, and Process Integration teams to optimize overall process flow.
• Support installation, qualification, and acceptance of new deposition equipment.
• Develop engineering specifications, process documentation, qualification reports, and standard operating procedures.
• Utilize Statistical Process Control (SPC) to monitor process health and stability.
• Support Advanced Process Control (APC) implementation for improved manufacturing consistency.
• Participate in technology transfer and New Product Introduction (NPI) activities.
• Perform root cause analysis for process excursions and yield losses.
• Improve throughput, productivity, and manufacturing efficiency.
• Ensure compliance with semiconductor quality systems, cleanroom protocols, and EHS standards.
• Drive Lean Manufacturing and continuous improvement initiatives.

Key Responsibilities During Fab Startup

• Support installation and qualification of thin film deposition tools.
• Develop baseline deposition recipes for manufacturing.
• Establish process qualification methodologies.
• Define process specifications and control plans.
• Qualify deposition materials, precursors, and process gases.
• Support engineering builds, pilot production, and technology transfer.
• Develop manufacturing SOPs and engineering documentation.
• Train production personnel on deposition processes.
• Improve process capability before production ramp.
• Support high-volume manufacturing readiness.

Required Qualifications

• Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Semiconductor Engineering, or related discipline.
• 6 15 years of semiconductor wafer fabrication experience.
• Strong expertise in thin film deposition technologies.
• Experience supporting advanced semiconductor manufacturing.
• Proven expertise in process optimization, technology transfer, and yield improvement.
• Excellent analytical, troubleshooting, and communication skills.

Technical Skills Semiconductor Manufacturing

• Semiconductor Wafer Fabrication
• Front-End Manufacturing (FEOL)
• CMOS Process Technology
• High Volume Manufacturing (HVM)
• Semiconductor Process Development
• Technology Transfer
• Process Qualification
• New Product Introduction (NPI)

Thin Film Deposition Technologies

• Chemical Vapor Deposition (CVD)
• Plasma Enhanced Chemical Vapor Deposition (PECVD)
• Low Pressure Chemical Vapor Deposition (LPCVD)
• Atmospheric Pressure CVD (APCVD)
• Atomic Layer Deposition (ALD)
• Physical Vapor Deposition (PVD)
• Magnetron Sputtering
• Reactive Sputtering
• Thermal Evaporation
• Electron Beam Evaporation
• Molecular Beam Epitaxy (MBE) (Preferred)
• Epitaxial Silicon Growth
• Selective Epitaxy

Film Types

• Silicon Dioxide (SiO )
• Silicon Nitride (Si N )
• Polysilicon
• Amorphous Silicon
• High-k Dielectrics
• Low-k Dielectrics
• Tungsten
• Titanium
• Titanium Nitride (TiN)
• Tantalum
• Tantalum Nitride (TaN)
• Copper Seed Layers
• Barrier Films
• Metal Gate Films
• Hard Mask Films
• Passivation Layers

Process Materials

• Process Precursors
• Specialty Gases
• Carrier Gases
• Plasma Chemistry
• Deposition Consumables
• Wafer Cleaning Chemistry
• Chamber Conditioning
• Film Stress Optimization

Thin Film Equipment

Experience With Leading Deposition Platforms Such As

• Applied Materials Producer Series
• Applied Materials Endura
• Lam Research Deposition Systems
• ASM Epsilon
• ASM Eagle
• TEL Deposition Systems
• Kokusai Vertical Furnaces
• Novellus Systems
• Canon Anelva PVD Systems

Process Engineering

• Design of Experiments (DOE)
• Statistical Process Control (SPC)
• Process Capability (Cp/Cpk)
• Root Cause Analysis
• FMEA
• Film Stress Analysis
• Yield Improvement
• Process Characterization
• Process Window Development
• Defect Reduction

Metrology

• Ellipsometry
• Film Thickness Measurement
• X-Ray Reflectometry (XRR)
• X-Ray Diffraction (XRD)
• Four-Point Probe
• Stress Measurement
• Optical Inspection
• SEM Analysis
• TEM Analysis (Preferred)
• Surface Profilometry
• Defect Inspection
• Particle Inspection

Data Analysis

• JMP
• Python
• MATLAB
• SQL
• Microsoft Excel
• Statistical Analysis
• Data Visualization

Cross Functional Collaboration

The Thin Film Process Engineer Will Work Closely With

• Process Integration Engineering
• Lithography Engineering
• Etch Engineering
• CMP Engineering
• Diffusion Engineering
• Ion Implant Engineering
• Equipment Engineering
• Yield Engineering
• Manufacturing Engineering
• Metrology Engineering
• Product Engineering
• Failure Analysis
• Quality Engineering
• Automation Engineering
• Facilities Engineering

Preferred Industry Experience

Experience In Semiconductor Manufacturing For

• Logic Devices
• Memory Devices
• Foundry Manufacturing
• Analog & Mixed-Signal ICs
• Power Semiconductor Devices
• RF Technologies
• Advanced CMOS Manufacturing

Candidates with experience in greenfield fab startups, advanced technology nodes (28nm and below), or high-volume manufacturing environments are highly preferred.

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