Assembly Process Engineering Manager – Semiconductor Packaging

Assembly Process Engineering Manager Semiconductor Packaging

Location: Ahmedabad, Gujarat, India

Work Mode: Onsite

Employment Type: Full-Time

Experience: 12 18 Years

Industry: Semiconductor / ATMP / OSAT / IC Packaging

Role Overview

We are looking for an Assembly Process Engineering Manager to lead semiconductor packaging-process engineering in a high-volume ATMP/OSAT manufacturing environment. The role will own process development, qualification, production ramp-up, process stability, yield improvement and engineering-team performance.

The position requires hands-on expertise in die preparation, die attach, wire bonding, molding, marking and package singulation, along with proven experience leading cross-functional engineering programs.

Key Responsibilities

• Lead the assembly process-engineering team supporting high-volume semiconductor packaging operations.
• Own process performance across wafer preparation, die attach, wire bonding, molding, marking and singulation.
• Develop and optimize process recipes, process windows, control plans and operating procedures.
• Lead process characterization, equipment qualification and production release activities.
• Drive new-product introduction, package qualification and transfer into volume manufacturing.
• Execute DOE, SPC and process-capability studies to improve yield and process stability.
• Monitor defect trends, scrap, rework, process excursions and critical manufacturing parameters.
• Lead root-cause analysis and corrective actions for process, material, equipment and package-quality issues.
• Collaborate with equipment engineering to improve equipment capability, uptime and repeatability.
• Work with product engineering, quality, reliability and manufacturing teams to meet production targets.
• Qualify new assembly materials, consumables, suppliers and process changes.
• Develop PFMEA, control plans, OCAPs, 8D reports and CAPA actions.
• Reduce process variation, manufacturing cycle time, scrap and cost of poor quality.
• Establish Best Known Methods and ensure consistent implementation across production lines.
• Build technical capability through recruitment, training, mentoring and succession planning.
• Support internal, customer and quality-system audits related to assembly processes.
  
  

Required Qualifications

• Bachelor s or Master s degree in Electronics, Electrical, Mechanical, Materials, Chemical, Manufacturing Engineering or a related discipline.
• 12 18 years of experience in semiconductor assembly, IC packaging, ATMP, OSAT or IDM backend manufacturing.
• At least 4 6 years of experience managing process engineers or leading major assembly-engineering programs.
• Strong hands-on experience in multiple semiconductor packaging processes.
• Experience transferring new products and processes into high-volume manufacturing.
• Proven success in yield improvement, defect reduction and process-capability enhancement.
• Experience working with manufacturing, equipment, product, quality, reliability and supplier teams.
• Ability to support production escalations in a 24 7 manufacturing environment.
  
  

Technical Skills Assembly and Packaging Processes

• Wafer mounting, backgrinding and dicing
• Die preparation and die sorting
• Die attach and die bonding
• Wire bonding
• Flip-chip assembly
• Underfill and encapsulation
• Transfer or compression molding
• Trim and form
• Laser marking
• Package singulation
• Package inspection and handling
  
  

Process Engineering

• Process development and characterization
• Process-window optimization
• Equipment and process qualification
• Design of Experiments
• Statistical Process Control
• Process Capability Analysis
• Measurement System Analysis
• Defect and variation reduction
• Recipe and parameter management
• Best Known Method development
  
  

Quality and Problem-Solving

• PFMEA
• Control plans
• OCAP
• 8D problem-solving
• Root-cause analysis
• CAPA
• Fault Tree Analysis
• Process excursion management
• Change-point control
• Continuous improvement
  
  

Packaging Materials

• Die-attach adhesives and films
• Bond wires and bonding materials
• Mold compounds
• Substrates and leadframes
• Underfill materials
• Solder and interconnect materials
• Material qualification
• Supplier process qualification